电子组装的IPC标准列表

文章摘要：• Custom Storage CaseIPC-7711/21A电子组装件的返工与返修IPC/EIA J-STD-002BSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验IPC/EIA J-STD-003ASolderability Tests for Printed Boards 印制板可焊性试验IPC-TR-461Trouble-Shooting Checklist for Wave Soldering Printed

电子组装的IPC标准列表,标签：电子行业标准,http://www.88dzw.com
• Custom Storage Case
IPC-7711/21A电子组装件的返工与返修IPC/EIA J-STD-002BSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验IPC/EIA J-STD-003ASolderability Tests for Printed Boards
印制板可焊性试验IPC-TR-461Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
印制板波峰焊故障排除检查表
IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
带保护性涂层印制板长期贮存的可焊性评价IPC-TR-464Accelerated Aging for Solderability Evaluations
可焊性加速老化评价(附修订)IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results
蒸汽老化时间与温度对可焊性试验结果的影响IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase IIA
替代涂覆层的蒸汽老化评价
IPC-TR-466Technical Report: Wetting Balance Standard Weight Comparison Test
技术报告: 润湿天平称重标准对比测试
SMC-WP-001Soldering Capability White Paper Report
可焊性工艺导论SMC-WP-005PCB Surface Finishes
印制电路板表面清洗

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