BGA下过孔的影响

标签：eda技术,
BGA下过孔的影响:In this paper, the impact of power/ground via arrays on power plane impedance is studied. 8 x 8 via array structures are characterized and the results are compared to fullwave field simulation using HFSS. These results show that the impedance and effective
inductance is a strong function of location within the array. The lowest impedance is
found on the array perimeter and the impedance is several times higher in the array
center. The impact antipad size and dielectric thickness on the plane impedance and
inductance is examined using parameterized models.， 大小：637 KB