安装说明NIS6111无铅封装

标签：电源技术资料下载,
Various ON Semiconductor components are packaged in an advanced Quad Flat−Pack No−Lead Package (QFN) or commonly referred to as a Leadless Package. Because the
QFN (Leadless) platform represent the latest in surface mount packaging technology, it is important that the design of the Printed Circuit Board (PCB), as well as the assembly
process, follow the suggested guidelines outlined in this document.， 大小：624 KB