安装笔记四扁平封装无铅包装

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Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface mount packaging technology, it is important that the design of the Printed Circuit Board (PCB), as well as the assembly process, follows the suggested guidelines outlined in this document.， 大小：763 KB